this is information on a product in full production. june 2012 doc id 023286 rev 1 1/7 7 CPL-WB-02D3 wide-band, directional coupler with integrated 50 oh m loaded isolated port datasheet ? production data features 50 nominal input / output impedance wide operating frequency range (2400 mhz to 5850 mhz) low insertion loss coupling factor: ? 18 db at 2.4 ghz ? 12 db at 5 ghz high esd robustness packaged in flip chip package thickness: < 595 m after reflow small footprint benefits very low profile lead-free package high rf performance rf module size reduction applications quad-band power amplifier module quad-band front end module wlan figure 1. pin configuration (bump view) description the CPL-WB-02D3 is a wide-band directional coupler designed to measure rf antenna output power. this cpl has been customized for wide band operating frequencies (2g/5g wlan) with low insertion losses in the transmit bandwidth (2400 mhz to 5850 mhz). the CPL-WB-02D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performance. the device is delivered 100% tested in tape and reel. flip chip (5 bumps) b 1 2 3 a cpld rf in gnd gnd rf out 50 www.st.com
characteristics CPL-WB-02D3 2/7 doc id 023286 rev 1 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power rf in 25 dbm v esd (hbm) human body model, jesd22-a114-b, all i/o 2 kv v esd (mm) machine model, jesd22-a115-a, all i/o 100 v v esd (cdm) charge device model, jesd22-c101-c, all i/o 500 v t op operating temperature -30 +85 oc table 2. electrical characteristics (t amb = 25 c) - impedances symbol parameter value unit min. typ. max. z out nominal output impedance 50 z in nominal input impedance 50 z cpld nominal coupling impedance 50 table 3. electrical characteristics (t amb = 25 c) - rf performance symbol parameter test condition value unit min. typ. max. t op operating temperature -30 +85 c f frequency range (bandwidth) 2400 5850 mhz i l insertion loss in bandwidth from 2400 mhz to 2500 mhz 0.2 db from 4900 mhz to 5850 mhz 0.5 r l return loss in bandwidth (in, out pins) from 2400 mhz to 5850 mhz 15 db cpld coupling factor from 2400 mhz to 2500 mhz 17 18 19 db from 4900 mhz to 5850 mhz 11 12 13 db
CPL-WB-02D3 pcb recommendation doc id 023286 rev 1 3/7 2 pcb recommendation figure 2. recommended land pattern layer 1 pads ?220 m out in cpl gnd gnd aperture 130 m
package information CPL-WB-02D3 4/7 doc id 023286 rev 1 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 3. package dimensions figure 4. footprint figure 5. marking 1.00 mm 45 m 1.35 mm 45 m 450 m 580 m 200 m 625 m ubm: ? 220 m 50 m 255 m copper pad diameter: 220 m recommended solder stencil opening: 220 m recommended solder mask opening: 300 m minimum 260 m maximum x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week)
CPL-WB-02D3 package information doc id 023286 rev 1 5/7 figure 6. tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348, ?ipad? 400 m flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.09 0.22 1.45 st st st xxz xxz xxz yww yww yww
ordering information CPL-WB-02D3 6/7 doc id 023286 rev 1 4 ordering information 5 revision history table 4. ordering information order code marking package weight base qty delivery mode CPL-WB-02D3 se flip chip 1.59 mg 5000 tape and reel table 5. document revision history date revision changes 18-jun-2012 1 initial release
CPL-WB-02D3 doc id 023286 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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